We’re excited to introduce the EZ-GS0760 Dynamic Wafer Stage (DWS) from Eitzenberger now featured in a new video showcasing its cutting-edge capabilities. Watch it here!
Key Features:
- Engineered for ultra-high dynamic applications like laser fuse cutting
- Incorporates Double Impulse Decoupling for enhanced stability and speed
- Nanometer-precision positioning, ideal for high-speed scanning and precise wafer handling Eitzenberger GmbH – Luftlager+1
Performance Highlights:
- Integrated SIOS differential laser interferometer for Abbe-error-free accuracy
- Y-axis acceleration up to 8 g, with continuous operation reaching 2 g when water-cooled
- Compact design (just 87 mm tall), large granite top plate, and suitability for cleanroom integration Eitzenberger GmbH – Luftlager
