A Glimpse at the Online Event – Failure analysis and defect inspection – Quality and process control – Flexible R&D solution – Basic configuration to turnkey solution – Hotspot detection on printed circuit boards, integrated circuits, semiconductor material and multi-chip modules – Detection of faulty thermal connections of heat sinks, short circuits, soldering defects and wire bonding errors Technical Lecture from Thermography Practice “Challenges and Applications of Thermography in Microelectronics” Speaker: Marko Hoffmann, Infineon Technologies Dresden GmbH & Co. KG
